XC6SLX100-2FGG676C Programming IC Chip High Performance Low Power FPGA

XC6SLX100-2FGG676C Programmable IC Chip Package 676-FBGA DC and Switching Characteristics

Product: XC6SLX100-2FGG676C Programmable IC Chip

Specifications:
- Family: Spartan-6
- Device: XC6SLX100
- Speed Grade: -2
- Package: FGG676
- I/O Pins: 676
- Logic Cells: 101,261
- Slices: 15,850
- Block RAM: 4,860 Kb
- DSP Slices: 180
- Clock Management Tiles: 4
- Total RAM Bits: 4,812,800
- Operating Voltage: 1.0V - 1.2V
- Operating Temperature: -40°C to +100°C

Features:
- High-performance, low-power FPGA (Field-Programmable Gate Array)
- Designed for a wide range of applications
- Supports high-speed communication and processing requirements
- Industry-standard core voltages for efficient power consumption (1.0V - 1.2V)
- Large logic capacity with 101,261 logic cells
- Abundant I/O pins (676) for versatile connectivity options
- Integrated memory blocks (4,860 Kb) for efficient data storage
- DSP resources (180 slices) for digital signal processing
- Advanced clock management tiles (4) for precise timing control
- Wide operating temperature range for various environments
- Supports advanced design methodologies and tool flows

Package Details:
- Package Type: FGG676
- Pin Count: 676
- Pin Pitch: 1.0mm
- Package Dimensions: 27mm x 27mm

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XC6SLX100-2FGG676C Programming IC Chip High Performance Low Power FPGA Images